Product Features
High Precision Manufacturing
Advanced equipment ensures precise production
Strict Quality Control
100% electrical testing and visual inspection
Fast Turnaround
Quick delivery times for prototypes and mass production
Competitive Pricing
Cost-effective solutions without compromising quality
Quality Assurance
ISO Certified
ISO 9001:2015 & IATF 16949
UL Listed
UL 796 & UL 94V-0 Certified
100% Tested
Flying probe and AOI testing
12 Month Warranty
Comprehensive warranty coverage
HDI PCBs
High Density Interconnect (HDI) PCBs feature microvias and fine lines, enabling higher component density and better electrical performance. HDI technology supports miniaturization trends in consumer electronics, mobile devices, and wearable technology while maintaining excellent signal integrity.
Quick Specifications
Technical Specifications
9 Parameters| Parameter | Specification |
|---|---|
|
Layer Count
Technical requirement
|
4-12 Layers
|
|
Microvia Types
Technical requirement
|
Laser, UV, Plasma
|
|
Material Type
Technical requirement
|
FR-4 High Tg, Rogers Materials
|
|
Board Thickness
Technical requirement
|
0.4mm - 1.6mm
|
|
Copper Weight
Technical requirement
|
0.5-1oz (18-35μm)
|
|
Min Line/Space
Technical requirement
|
2mil/2mil
|
|
Via Diameter
Technical requirement
|
0.05mm - 0.15mm
|
|
Via Fill
Technical requirement
|
Copper Conductive Fill
|
|
Aspect Ratio
Technical requirement
|
0.75:1
|
Manufacturing Process
7 StepsLaser Drilling
Step 1CO2/UV laser microvias
Desmear
Step 2Plasma desmear process
Via Metallization
Step 3Electroless copper plating
Sequential Build-up
Step 4Multiple build-up layers
Via Fill
Step 5Conductive via filling
Fine Line Imaging
Step 6Advanced photolithography
Final Finish
Step 7ENEPIG or OSP
Typical Applications
6 IndustriesReady to Get Started?
Contact our engineering team for a custom quote or explore our full range of PCB products.
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