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High Speed PCBs

Technical Specifications and Manufacturing Process

PCB Image

Product Features

High Precision Manufacturing

Advanced equipment ensures precise production

Strict Quality Control

100% electrical testing and visual inspection

Fast Turnaround

Quick delivery times for prototypes and mass production

Competitive Pricing

Cost-effective solutions without compromising quality

Quality Assurance

ISO Certified

ISO 9001:2015 & IATF 16949

UL Listed

UL 796 & UL 94V-0 Certified

100% Tested

Flying probe and AOI testing

12 Month Warranty

Comprehensive warranty coverage

High Speed PCBs

High Speed PCBs are engineered for high-frequency and high-speed digital signals, featuring controlled impedance and low-loss materials. These boards deliver exceptional signal integrity for data transmission, telecommunications, and advanced computing applications.

Quick Specifications

Layer Count
4-20 Layers
Material
Rogers, Megtron, Isola
Board Thickness
0.8mm - 3.2mm
Copper Weight
0.5-1oz
Min Line/Space
2mil/2mil
Min Hole Size
0.1mm

Technical Specifications

9 Parameters
Parameter Specification
Layer Count
Technical requirement
4-20 Layers
Standard compliance
Material Type
Technical requirement
Rogers, Megtron, Isola
Standard compliance
Dielectric Constant
Technical requirement
3.0 - 4.5
Standard compliance
Loss Tangent
Technical requirement
0.001 - 0.003
Standard compliance
Impedance Control
Technical requirement
±5% (Single-ended), ±10% (Differential)
Standard compliance
Min Line/Space
Technical requirement
2mil/2mil
Standard compliance
Data Rate Support
Technical requirement
Up to 56Gbps+
Standard compliance
Frequency Range
Technical requirement
DC to 110GHz+
Standard compliance
Copper Roughness
Technical requirement
Ultra-Low Profile
Standard compliance

Manufacturing Process

7 Steps
1
Material Selection
Step 1

Low-loss dielectric materials

Initial Stage
Quality Controlled
2
Impedance Modeling
Step 2

Differential pair design

Intermediate Stage
Quality Controlled
3
Precision Lamination
Step 3

Controlled stack-up

Intermediate Stage
Quality Controlled
4
Fine Line Etching
Step 4

Precision copper etching

Intermediate Stage
Quality Controlled
5
Surface Finish
Step 5

ENEPIG for minimal loss

Intermediate Stage
Quality Controlled
6
Impedance Testing
Step 6

Intermediate Stage
Quality Controlled
7
VNA Testing
Step 7

High-frequency characterization

Final Stage
Quality Controlled

Typical Applications

6 Industries
Network Equipment
Industry Proven
Data Centers
Industry Proven
5G/6G Devices
Industry Proven
High-Speed Computing
Industry Proven
Video Streaming
Industry Proven
Satellite Communications
Industry Proven

Ready to Get Started?

Contact our engineering team for a custom quote or explore our full range of PCB products.

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Real feedback from verified customers across the world

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