USD/CNY --
USD/VND --
CNY/VND --
Cu(Changj) ¥--
Gold ¥--/g

RF/Microwave PCBs

Technical Specifications and Manufacturing Process

PCB Image

Product Features

High Precision Manufacturing

Advanced equipment ensures precise production

Strict Quality Control

100% electrical testing and visual inspection

Fast Turnaround

Quick delivery times for prototypes and mass production

Competitive Pricing

Cost-effective solutions without compromising quality

Quality Assurance

ISO Certified

ISO 9001:2015 & IATF 16949

UL Listed

UL 796 & UL 94V-0 Certified

100% Tested

Flying probe and AOI testing

12 Month Warranty

Comprehensive warranty coverage

RF/Microwave PCBs

RF/Microwave PCBs are designed with low-loss materials and precise impedance control for high-frequency applications. These boards deliver optimal performance for wireless communications, radar systems, and aerospace electronics operating in the RF to microwave frequency range.

Quick Specifications

Layer Count
2-16 Layers
Material
Rogers, Taconic, Arlon
Board Thickness
0.5mm - 3.0mm
Copper Weight
0.5-2oz
Min Line/Space
3mil/3mil
Min Hole Size
0.1mm

Technical Specifications

9 Parameters
Parameter Specification
Frequency Range
Technical requirement
DC - 110GHz+
Standard compliance
Material Type
Technical requirement
Rogers, Taconic, Arlon
Standard compliance
Dielectric Constant
Technical requirement
2.1 - 10.2
Standard compliance
Loss Tangent
Technical requirement
0.0009 - 0.0035
Standard compliance
Impedance Control
Technical requirement
±2% to ±5%
Standard compliance
Min Line/Space
Technical requirement
3mil/3mil
Standard compliance
Copper Roughness
Technical requirement
Low Profile < 1.8μm
Standard compliance
Hole Plating
Technical requirement
Gold-Plated Through-Holes
Standard compliance
Surface Finish
Technical requirement
ENIG, Electroless Gold
Standard compliance

Manufacturing Process

7 Steps
1
Material Selection
Step 1

Low-loss RF materials

Initial Stage
Quality Controlled
2
Impedance Design
Step 2

RF transmission line design

Intermediate Stage
Quality Controlled
3
Precision Lamination
Step 3

Controlled dielectric

Intermediate Stage
Quality Controlled
4
Fine Line Etching
Step 4

Precise RF circuitry

Intermediate Stage
Quality Controlled
5
Gold Plating
Step 5

Low-loss edge plating

Intermediate Stage
Quality Controlled
6
VNA Testing
Step 6

Vector Network Analysis

Intermediate Stage
Quality Controlled
7
RF Validation
Step 7

Insertion loss testing

Final Stage
Quality Controlled

Typical Applications

6 Industries
Wireless Devices
Industry Proven
Base Stations
Industry Proven
Satellite Comms
Industry Proven
Radar Systems
Industry Proven
Aerospace
Industry Proven
Broadcast Equipment
Industry Proven

Ready to Get Started?

Contact our engineering team for a custom quote or explore our full range of PCB products.

Trusted by Global Clients

Real feedback from verified customers across the world

English 简体中文 繁體中文 Tiếng Việt 日本語 한국어
Global