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10-Layer PCBs

Technical Specifications and Manufacturing Process

PCB Image

Product Features

High Precision Manufacturing

Advanced equipment ensures precise production

Strict Quality Control

100% electrical testing and visual inspection

Fast Turnaround

Quick delivery times for prototypes and mass production

Competitive Pricing

Cost-effective solutions without compromising quality

Quality Assurance

ISO Certified

ISO 9001:2015 & IATF 16949

UL Listed

UL 796 & UL 94V-0 Certified

100% Tested

Flying probe and AOI testing

12 Month Warranty

Comprehensive warranty coverage

10-Layer PCBs

10-layer PCBs deliver maximum density for complex applications with demanding signal integrity requirements. With multiple ground planes and dedicated signal layers, these boards provide superior EMI performance for advanced aerospace, military, telecommunications, and high-speed computing applications.

Quick Specifications

Layer Count
10+ Layers
Material
FR-4 High Tg, Rogers, Megtron, ITEQ
Board Thickness
1.6mm - 3.2mm
Copper Weight
0.5-2oz
Min Line/Space
2.5mil/2.5mil
Min Hole Size
0.08mm
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Technical Specifications

9 Parameters
Parameter Specification
Layer Count
Technical requirement
10+
Standard compliance
Layer Stackup
Technical requirement
Fully Customizable
Standard compliance
Material Type
Technical requirement
FR-4 High Tg, Rogers, Megtron, ITEQ
Standard compliance
Board Thickness
Technical requirement
1.6mm - 3.2mm
Standard compliance
Copper Weight
Technical requirement
0.5-2oz (18-70μm)
Standard compliance
Min Line/Space
Technical requirement
2.5mil/2.5mil
Standard compliance
Min Hole Size
Technical requirement
0.08mm
Standard compliance
Impedance Control
Technical requirement
±5%
Standard compliance
Via Types
Technical requirement
All Types Including Laser Microvias
Standard compliance

All specifications meet industry standards

Updated: 2026

Manufacturing Process

7 Steps
1
Inner Layer Processing
Step 1

8+ inner layers fabrication

Initial Stage
Quality Controlled
2
Advanced Registration
Step 2

Sub-mil layer alignment

Intermediate Stage
Quality Controlled
3
Sequential Lamination
Step 3

Multi-step lamination process

Intermediate Stage
Quality Controlled
4
Laser Drilling
Step 4

CO2 laser for microvias

Intermediate Stage
Quality Controlled
5
Fill Plating
Step 5

Via fill technology

Intermediate Stage
Quality Controlled
6
Surface Finish
Step 6

ENEPIG, Hard Gold, OSP

Intermediate Stage
Quality Controlled
7
Comprehensive Testing
Step 7

Full electrical and functional test

Final Stage
Quality Controlled

Quality Assurance: Each manufacturing step undergoes rigorous quality control checks to ensure compliance with international standards.

Process Efficiency: >98%

Typical Applications

6 Industries
Aerospace Systems
Industry Proven
Military Electronics
Industry Proven
5G Infrastructure
Industry Proven
Supercomputing
Industry Proven
Autonomous Vehicles
Industry Proven
Medical Imaging
Industry Proven

Versatile Solutions: These PCBs are engineered to meet the demands of various industries, providing reliable performance across different applications.

Certified: ISO 9001:2015

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