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6-Layer PCBs

Technical Specifications and Manufacturing Process

PCB Image

Product Features

High Precision Manufacturing

Advanced equipment ensures precise production

Strict Quality Control

100% electrical testing and visual inspection

Fast Turnaround

Quick delivery times for prototypes and mass production

Competitive Pricing

Cost-effective solutions without compromising quality

Quality Assurance

ISO Certified

ISO 9001:2015 & IATF 16949

UL Listed

UL 796 & UL 94V-0 Certified

100% Tested

Flying probe and AOI testing

12 Month Warranty

Comprehensive warranty coverage

6-Layer PCBs

6-layer PCBs offer high-density solution for electronic systems requiring multiple signal and power planes. Ideal for high-speed digital circuits, the additional layers provide better signal integrity, reduced crosstalk, and improved EMI performance for demanding applications.

Quick Specifications

Layer Count
6 Layers
Material
FR-4 High Tg, Rogers
Board Thickness
1.0mm - 2.4mm
Copper Weight
1-2oz
Min Line/Space
3.5mil/3.5mil
Min Hole Size
0.15mm

Technical Specifications

9 Parameters
Parameter Specification
Layer Count
Technical requirement
6
Standard compliance
Layer Stackup
Technical requirement
Signal-Gnd-Signal-Signal-Pwr-Signal
Standard compliance
Material Type
Technical requirement
FR-4 High Tg, Rogers Materials
Standard compliance
Board Thickness
Technical requirement
1.0mm - 2.4mm
Standard compliance
Copper Weight
Technical requirement
1-2oz (35-70μm)
Standard compliance
Min Line/Space
Technical requirement
3.5mil/3.5mil
Standard compliance
Min Hole Size
Technical requirement
0.15mm
Standard compliance
Impedance Control
Technical requirement
±8%
Standard compliance
Differential Pairs
Technical requirement
Yes
Standard compliance

Manufacturing Process

7 Steps
1
Inner Layer Imaging
Step 1

Photolithography for 4 inner layers

Initial Stage
Quality Controlled
2
Layer Registration
Step 2

Precision alignment of all layers

Intermediate Stage
Quality Controlled
3
Lamination
Step 3

6-layer lamination process

Intermediate Stage
Quality Controlled
4
Via Formation
Step 4

Through-hole and microvias

Intermediate Stage
Quality Controlled
5
Copper Plating
Step 5

Uniform plating of all vias

Intermediate Stage
Quality Controlled
6
Surface Finish
Step 6

ENIG, ENEPIG, OSP

Intermediate Stage
Quality Controlled
7
Final Testing
Step 7

Impedance and electrical testing

Final Stage
Quality Controlled

Typical Applications

6 Industries
Industrial Computers
Industry Proven
Network Equipment
Industry Proven
Automotive ECU
Industry Proven
Video Processing
Industry Proven
Embedded Systems
Industry Proven
Industrial IoT
Industry Proven

Ready to Get Started?

Contact our engineering team for a custom quote or explore our full range of PCB products.

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