Product Features
High Precision Manufacturing
Advanced equipment ensures precise production
Strict Quality Control
100% electrical testing and visual inspection
Fast Turnaround
Quick delivery times for prototypes and mass production
Competitive Pricing
Cost-effective solutions without compromising quality
Quality Assurance
ISO Certified
ISO 9001:2015 & IATF 16949
UL Listed
UL 796 & UL 94V-0 Certified
100% Tested
Flying probe and AOI testing
12 Month Warranty
Comprehensive warranty coverage
8-Layer PCBs
8-layer PCBs provide ultra-high density for cutting-edge technology applications. With dedicated ground and power planes, these boards offer exceptional signal integrity and minimal EMI for high-performance computing, telecommunications, and advanced electronic systems.
Quick Specifications
Technical Specifications
9 Parameters| Parameter | Specification |
|---|---|
|
Layer Count
Technical requirement
|
8
|
|
Layer Stackup
Technical requirement
|
Custom Configuration Available
|
|
Material Type
Technical requirement
|
FR-4 High Tg, Rogers, Megtron
|
|
Board Thickness
Technical requirement
|
1.2mm - 2.8mm
|
|
Copper Weight
Technical requirement
|
0.5-2oz (18-70μm)
|
|
Min Line/Space
Technical requirement
|
3mil/3mil
|
|
Min Hole Size
Technical requirement
|
0.1mm
|
|
Impedance Control
Technical requirement
|
±5%
|
|
Via Types
Technical requirement
|
Through, Blind, Buried, Microvias
|
Manufacturing Process
7 StepsInner Layer Imaging
Step 16 inner layers patterning
Precision Alignment
Step 2Layer-to-layer registration
Multi-Lamination
Step 38-layer stack-up lamination
Microvia Drilling
Step 4Laser drilling for microvias
Sequential Plating
Step 5Multiple plating cycles
High-Tg Solder Mask
Step 6Advanced mask materials
Electrical Testing
Step 7100% flying probe test
Typical Applications
6 IndustriesReady to Get Started?
Contact our engineering team for a custom quote or explore our full range of PCB products.
Trusted by Global Clients
Real feedback from verified customers across the world
