Product Features
High Precision Manufacturing
Advanced equipment ensures precise production
Strict Quality Control
100% electrical testing and visual inspection
Fast Turnaround
Quick delivery times for prototypes and mass production
Competitive Pricing
Cost-effective solutions without compromising quality
Quality Assurance
ISO Certified
ISO 9001:2015 & IATF 16949
UL Listed
UL 796 & UL 94V-0 Certified
100% Tested
Flying probe and AOI testing
12 Month Warranty
Comprehensive warranty coverage
4-Layer PCBs
4-layer PCBs provide enhanced routing capability for complex designs by adding two inner signal layers. This design offers improved signal integrity, better power distribution, and reduced EMI compared to double-sided boards. Ideal for microcontroller-based systems and communication devices.
Quick Specifications
Technical Specifications
9 Parameters| Parameter | Specification |
|---|---|
|
Layer Count
Technical requirement
|
4
|
|
Layer Stackup
Technical requirement
|
Signal-Ground-Power-Signal
|
|
Material Type
Technical requirement
|
FR-4 High Tg (TG140-170)
|
|
Board Thickness
Technical requirement
|
0.8mm - 2.4mm
|
|
Copper Weight
Technical requirement
|
1-2oz (35-70μm)
|
|
Min Line/Space
Technical requirement
|
4mil/4mil
|
|
Min Hole Size
Technical requirement
|
0.2mm
|
|
Impedance Control
Technical requirement
|
±10%
|
|
Via Types
Technical requirement
|
Through-hole, Blind, Buried
|
Manufacturing Process
7 StepsInner Layer Imaging
Step 1Photolithography for inner layers
Inner Layer Etching
Step 2Precision etching of inner copper
Lamination
Step 3Multi-layer lamination under pressure
Drilling
Step 4Through-hole and blind via drilling
Plating
Step 5Copper plating of all vias
Outer Layer Patterning
Step 6Final trace patterning
Solder Mask
Step 7Protective coating application
Typical Applications
6 IndustriesReady to Get Started?
Contact our engineering team for a custom quote or explore our full range of PCB products.
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